New optoelectronic devices for the Near and Mid-Infrared spectral range open completely new possibilities for portable sensors creation. Using infrared LED-PD optopairs allows developing an instrument that is smaller, less expensive and energy-saving.

Packages for LEDs

Generally LEDs are mounted in the package that provides two electrical leads, a transparent optical window for the emission and heat-sinking. An LED chip is soldered/glued to the package surface that is connected to the one of the lead wires. Top contact of the chip is connected to the other lead with a bonding wire.

We offer a range of standard and customized TO- and SMD-type packages:

TO-18 – for mounting one-element LEDs, single-wavelength matrices, 2-wavelength matrices

TO-18 with cap with glass window
Technical Drawing  

TO-18 with cap without window
Technical Drawing  

TO-18 with parabolic reflector with quartz/sapphire window
Technical Drawing  

TO-18 with parabolic reflector without window
Technical Drawing  
TO5 (TO39) – for mounting one element LEDs or LED-matrices

TO-5 with built-in TEM covered by cap with quartz/sapphire window
Technical Drawing  

TO-5 with built-in TEM covered by parabolic reflector with quartz/sapphire window
Technical Drawing  
  
  
TO8 – for mounting multi-element LED-matrices

TO-8 with built-in TEM covered by cap with quartz/sapphire window
Technical Drawing   
  
  
  
SMD type packages

CS3020 (SMD 3x2 mm)
Technical Drawing   

CS35 (SMD 3.5x3.5 mm)
Technical Drawing   

CS5-3M (SMD 5x5 mm) (for three-element LED matrices)
Technical Drawing